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Power Delivery and Thermal-Aware Electronic Design Automation Solutions for High-Performance 3D ICs
Power Delivery and Thermal-Aware Electronic Design Automation Solutions for High-Performance 3D ICs
상세정보
- 자료유형
- 학위논문 서양
- 최종처리일시
- 20260209102911
- ISBN
- 9798265402677
- DDC
- 621.31
- 저자명
- Zhu, Lingjun.
- 서명/저자
- Power Delivery and Thermal-Aware Electronic Design Automation Solutions for High-Performance 3D ICs
- 발행사항
- [Sl] : Georgia Institute of Technology, 2023
- 발행사항
- Ann Arbor : ProQuest Dissertations & Theses, 2023
- 형태사항
- 189 p
- 주기사항
- Source: Dissertations Abstracts International, Volume: 87-06, Section: B.
- 주기사항
- Advisor: Lim, Sung Kyu.
- 학위논문주기
- Thesis (Ph.D.)--Georgia Institute of Technology, 2023.
- 초록/해제
- 요약The objective of this research is to explore 3D IC design methodologies and develop Electronic Design Automation (EDA) solutions to evaluate and mitigate power delivery and thermal challenges in high-performance 3D ICs with emerging interconnects and advanced CMOS technology. Specifically, we implement tool flows to enable 3D IC physical design with various design and technology assumptions based on existing EDA software and customized algorithms. Using a novel 3D RTL-to-GDS design flow, we improve the performance of heterogeneous 3D ICs, investigate emerging computing systems such as logic-on-memory stacked 3D CPU, and explore the PPA, power delivery, and thermal impacts of 3D integration. With a comprehensive analysis of 3D IC power delivery and thermal integrity, we propose EDA methods to quickly analyze thermal sustainability, explore design trade-offs, and generate floorplan and cooling solutions for large-scale 3D computing systems. In addition, we study the trend of power delivery issues in 3D ICs with technology scaling. We identify key power delivery challenges and bottlenecks considering various technology nodes and applications, propose robust 2D/3D PDN structures and design strategies, and evaluate the system-level impacts on PPA and power integrity.
- 일반주제명
- Electricity generation
- 일반주제명
- Electric power
- 일반주제명
- 3-D technology
- 일반주제명
- Engineering
- 일반주제명
- Electrical engineering
- 기본자료저록
- Dissertations Abstracts International. 87-06B.
- 전자적 위치 및 접속
- 로그인 후 원문을 볼 수 있습니다.
MARC
008260203s2023 us c eng d■001000017365998
■00520260209102911
■006m o d
■007cr#unu||||||||
■020 ▼a9798265402677
■035 ▼a(MiAaPQ)AAI32315836
■035 ▼a(MiAaPQ)GeorgiaTech76809
■040 ▼aMiAaPQ▼cMiAaPQ
■0820 ▼a621.31
■1001 ▼aZhu, Lingjun.
■24510▼aPower Delivery and Thermal-Aware Electronic Design Automation Solutions for High-Performance 3D ICs
■260 ▼a[Sl]▼bGeorgia Institute of Technology▼c2023
■260 1▼aAnn Arbor▼bProQuest Dissertations & Theses▼c2023
■300 ▼a189 p
■500 ▼aSource: Dissertations Abstracts International, Volume: 87-06, Section: B.
■500 ▼aAdvisor: Lim, Sung Kyu.
■5021 ▼aThesis (Ph.D.)--Georgia Institute of Technology, 2023.
■520 ▼aThe objective of this research is to explore 3D IC design methodologies and develop Electronic Design Automation (EDA) solutions to evaluate and mitigate power delivery and thermal challenges in high-performance 3D ICs with emerging interconnects and advanced CMOS technology. Specifically, we implement tool flows to enable 3D IC physical design with various design and technology assumptions based on existing EDA software and customized algorithms. Using a novel 3D RTL-to-GDS design flow, we improve the performance of heterogeneous 3D ICs, investigate emerging computing systems such as logic-on-memory stacked 3D CPU, and explore the PPA, power delivery, and thermal impacts of 3D integration. With a comprehensive analysis of 3D IC power delivery and thermal integrity, we propose EDA methods to quickly analyze thermal sustainability, explore design trade-offs, and generate floorplan and cooling solutions for large-scale 3D computing systems. In addition, we study the trend of power delivery issues in 3D ICs with technology scaling. We identify key power delivery challenges and bottlenecks considering various technology nodes and applications, propose robust 2D/3D PDN structures and design strategies, and evaluate the system-level impacts on PPA and power integrity.
■590 ▼aSchool code: 0078.
■650 4▼aElectricity generation
■650 4▼aElectric power
■650 4▼a3-D technology
■650 4▼aEngineering
■650 4▼aElectrical engineering
■653 ▼aElectronic Design Automation
■653 ▼aThermal sustainability
■690 ▼a0544
■690 ▼a0537
■71020▼aGeorgia Institute of Technology.
■7730 ▼tDissertations Abstracts International▼g87-06B.
■790 ▼a0078
■791 ▼aPh.D.
■792 ▼a2023
■793 ▼aEnglish
■85640▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T17365998▼nKERIS▼z이 자료의 원문은 한국교육학술정보원에서 제공합니다.
