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Solution-Processed Thin-Film Materials for High-Performance Nanoelectronics
Solution-Processed Thin-Film Materials for High-Performance Nanoelectronics
Solution-Processed Thin-Film Materials for High-Performance Nanoelectronics

Detailed Information

자료유형  
 학위논문 서양
최종처리일시  
20260202105657
ISBN  
9798265453136
DDC  
620.11
저자명  
An, Fufei.
서명/저자  
Solution-Processed Thin-Film Materials for High-Performance Nanoelectronics
발행사항  
[Sl] : University of Illinois at Urbana-Champaign, 2024
발행사항  
Ann Arbor : ProQuest Dissertations & Theses, 2024
형태사항  
181 p
주기사항  
Source: Dissertations Abstracts International, Volume: 87-06, Section: B.
주기사항  
Advisor: Cao, Qing.
학위논문주기  
Thesis (Ph.D.)--University of Illinois at Urbana-Champaign, 2024.
초록/해제  
요약The burgeoning field of solution-processed nanomaterials for high-performance transistors and thin-film transistor (TFT) applications is poised to revolutionize the electronics industry with cost-effective, scalable, and versatile manufacturing processes. Distinguished from conventional high-temperature, vacuum-based techniques, solution processing allows for lower-temperature fabrication and is amenable to roll-to-roll manufacturing, paving the way for flexible electronic devices. At the core of this thesis is the development and utilization of quasi-2D amorphous carbon and Cu-In-Se based metal chalcogenide thin films via solution-based techniques. Targeting for next-generation high performance low-dimensional transistors, the solution-based strategy for fabricating ultrathin quasi-2D amorphous carbon films and their few-layered assemblies offers substantial advantages in terms of wafer-size scalability, low cost, and especially the capability to form multilayers with precisely controlled thickness in a layer-by-layer fashion. These carbon films exhibit exceptional properties for nanoelectronics, enhancing performances while reducing power consumption due to their amorphous structure and low surface dangling bond density. Meanwhile, Cu-In-Se-based chalcogenide films demonstrate exceptional compositional and uniformity control, ideal for low-power TFTs, due to their advanced mobility, stability, and substrate adaptability. This thesis underscores the importance of aligning nanomaterial innovation with specific technological needs and the seamless integration of these new materials into the existing semiconductor manufacturing landscape to overcome future challenges.
일반주제명  
Materials science
일반주제명  
Electrical engineering
일반주제명  
Engineering
일반주제명  
Nanotechnology
키워드  
Solution-process
키워드  
Amorphous carbon
키워드  
2D materials
키워드  
Thin-film materials
키워드  
Nanoelectronics
기타저자  
University of Illinois at Urbana-Champaign Materials Science & Engineerng
기본자료저록  
Dissertations Abstracts International. 87-06B.
전자적 위치 및 접속  
로그인 후 원문을 볼 수 있습니다.

MARC

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■260    ▼a[Sl]▼bUniversity  of  Illinois  at  Urbana-Champaign▼c2024
■260  1▼aAnn  Arbor▼bProQuest  Dissertations  &  Theses▼c2024
■300    ▼a181  p
■500    ▼aSource:  Dissertations  Abstracts  International,  Volume:  87-06,  Section:  B.
■500    ▼aAdvisor:  Cao,  Qing.
■5021  ▼aThesis  (Ph.D.)--University  of  Illinois  at  Urbana-Champaign,  2024.
■520    ▼aThe  burgeoning  field  of  solution-processed  nanomaterials  for  high-performance  transistors  and  thin-film  transistor  (TFT)  applications  is  poised  to  revolutionize  the  electronics  industry  with  cost-effective,  scalable,  and  versatile  manufacturing  processes.  Distinguished  from  conventional  high-temperature,  vacuum-based  techniques,  solution  processing  allows  for  lower-temperature  fabrication  and  is  amenable  to  roll-to-roll  manufacturing,  paving  the  way  for  flexible  electronic  devices.                          At  the  core  of  this  thesis  is  the  development  and  utilization  of  quasi-2D  amorphous  carbon  and  Cu-In-Se  based  metal  chalcogenide  thin  films  via  solution-based  techniques.  Targeting  for  next-generation  high  performance  low-dimensional  transistors,  the  solution-based  strategy  for  fabricating  ultrathin  quasi-2D  amorphous  carbon  films  and  their  few-layered  assemblies  offers  substantial  advantages  in  terms  of  wafer-size  scalability,  low  cost,  and  especially  the  capability  to  form  multilayers  with  precisely  controlled  thickness  in  a  layer-by-layer  fashion.  These  carbon  films  exhibit  exceptional  properties  for  nanoelectronics,  enhancing  performances  while  reducing  power  consumption  due  to  their  amorphous  structure  and  low  surface  dangling  bond  density.  Meanwhile,  Cu-In-Se-based  chalcogenide  films  demonstrate  exceptional  compositional  and  uniformity  control,  ideal  for  low-power  TFTs,  due  to  their  advanced  mobility,  stability,  and  substrate  adaptability.  This  thesis  underscores  the  importance  of  aligning  nanomaterial  innovation  with  specific  technological  needs  and  the  seamless  integration  of  these  new  materials  into  the  existing  semiconductor  manufacturing  landscape  to  overcome  future  challenges.
■590    ▼aSchool  code:  0090.
■650  4▼aMaterials  science
■650  4▼aElectrical  engineering
■650  4▼aEngineering
■650  4▼aNanotechnology
■653    ▼aSolution-process
■653    ▼aAmorphous  carbon
■653    ▼a2D  materials
■653    ▼aThin-film  materials
■653    ▼aNanoelectronics
■690    ▼a0794
■690    ▼a0544
■690    ▼a0652
■690    ▼a0537
■71020▼aUniversity  of  Illinois  at  Urbana-Champaign▼bMaterials  Science  &  Engineerng.
■7730  ▼tDissertations  Abstracts  International▼g87-06B.
■790    ▼a0090
■791    ▼aPh.D.
■792    ▼a2024
■793    ▼aEnglish
■85640▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T17361042▼nKERIS▼z이  자료의  원문은  한국교육학술정보원에서  제공합니다.

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