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Multi-Material 3D Printing of Stretchable Electronics via Filamentary and Droplet-Based Deposition of Viscoelastic Inks
Multi-Material 3D Printing of Stretchable Electronics via Filamentary and Droplet-Based Deposition of Viscoelastic Inks
상세정보
- 자료유형
- 학위논문 서양
- 최종처리일시
- 20260202105137
- ISBN
- 9798265409935
- DDC
- 621
- 서명/저자
- Multi-Material 3D Printing of Stretchable Electronics via Filamentary and Droplet-Based Deposition of Viscoelastic Inks
- 발행사항
- [Sl] : Harvard University, 2025
- 발행사항
- Ann Arbor : ProQuest Dissertations & Theses, 2025
- 형태사항
- 152 p
- 주기사항
- Source: Dissertations Abstracts International, Volume: 87-05, Section: B.
- 주기사항
- Advisor: Lewis, Jennifer.
- 학위논문주기
- Thesis (Ph.D.)--Harvard University, 2025.
- 초록/해제
- 요약As the boundary between digital and biological systems continues to blur, the seamless integration of electronic devices with living tissue has emerged as a technological imperative. Yet most electronic devices contain materials with elastic moduli exceeding 100 GPa, while biological tissues are inherently soft with moduli ranging from 0.1 to 1000 kPa. This pronounced mechanical mismatch fundamentally impedes electronics-human tissue integration. Current soft electronics fabrication strategies deploy rigid materials that are geometrically patterned to facilitate stretchability, or soft materials that are intrinsically stretchable. Both strategies fail to robustly integrate rigid electronic components within stretchable matrices, as stress concentrations at rigid-soft interfaces inevitably cause delamination and electrical failure under cyclic loading. This challenge is particularly critical given that high performance rigid components lack soft analogues with comparable functionality and cost. My PhD dissertation establishes multi-material 3D printing via filamentary and droplet-based approaches, as transformative manufacturing platforms for robust electromechanical integration of rigid components within soft matrices with programmable mechanics. First, a hybrid direct ink writing (DIW) platform is developed, combining printable thermoplastic polyurethane (TPU) elastomers and conductive silver-TPU inks achieving conductivities up to 3x10⁶ S/m with robotic pick-and-place assembly. This approach enables fabrication of soft electronic devices including wearable strain sensors and microcontroller systems. Systematic characterization reveals that selective TPU reinforcement around rigid components extends their composite electromechanical strain tolerance sevenfold, from 17% to 120%. Building upon these insights, a novel droplet-based viscoelastic ink printing (DVIP) method is introduced, capable of spatially patterning multiple photocurable thiol-ene elastomers, with moduli spanning three orders of magnitude, through raster image processing. Integration of robotic assembly and printable liquid metal inks enables scalable fabrication of personalized stretchable devices with spatially programmable mechanical gradients surrounding embedded components. Devices incorporating zonally graded strain relief demonstrate 100-fold improvement in electrical fatigue life compared to uniform matrices, surviving 5000 strain cycles versus 50. The versatility of DVIP is further demonstrated through multi-layer architectures incorporating printed variable capacitance sensors, vertical interconnects, and selectively encapsulated circuit modules, establishing a scalable pathway for the digital printing of next-generation biointegrated electronics.
- 일반주제명
- Mechanical engineering
- 일반주제명
- Materials science
- 일반주제명
- Engineering
- 일반주제명
- Electrical engineering
- 키워드
- 3D printing
- 키워드
- Elastomers
- 키워드
- Inkjet
- 기타저자
- Harvard University Engineering and Applied Sciences - Engineering Sciences
- 기본자료저록
- Dissertations Abstracts International. 87-05B.
- 전자적 위치 및 접속
- 로그인 후 원문을 볼 수 있습니다.
MARC
008260126s2025 us c eng d■001000017359559
■00520260202105137
■006m o d
■007cr#unu||||||||
■020 ▼a9798265409935
■035 ▼a(MiAaPQ)AAI32240083
■040 ▼aMiAaPQ▼cMiAaPQ
■0820 ▼a621
■1001 ▼aBusbee, Travis Alexander.
■24510▼aMulti-Material 3D Printing of Stretchable Electronics via Filamentary and Droplet-Based Deposition of Viscoelastic Inks
■260 ▼a[Sl]▼bHarvard University▼c2025
■260 1▼aAnn Arbor▼bProQuest Dissertations & Theses▼c2025
■300 ▼a152 p
■500 ▼aSource: Dissertations Abstracts International, Volume: 87-05, Section: B.
■500 ▼aAdvisor: Lewis, Jennifer.
■5021 ▼aThesis (Ph.D.)--Harvard University, 2025.
■520 ▼aAs the boundary between digital and biological systems continues to blur, the seamless integration of electronic devices with living tissue has emerged as a technological imperative. Yet most electronic devices contain materials with elastic moduli exceeding 100 GPa, while biological tissues are inherently soft with moduli ranging from 0.1 to 1000 kPa. This pronounced mechanical mismatch fundamentally impedes electronics-human tissue integration. Current soft electronics fabrication strategies deploy rigid materials that are geometrically patterned to facilitate stretchability, or soft materials that are intrinsically stretchable. Both strategies fail to robustly integrate rigid electronic components within stretchable matrices, as stress concentrations at rigid-soft interfaces inevitably cause delamination and electrical failure under cyclic loading. This challenge is particularly critical given that high performance rigid components lack soft analogues with comparable functionality and cost. My PhD dissertation establishes multi-material 3D printing via filamentary and droplet-based approaches, as transformative manufacturing platforms for robust electromechanical integration of rigid components within soft matrices with programmable mechanics. First, a hybrid direct ink writing (DIW) platform is developed, combining printable thermoplastic polyurethane (TPU) elastomers and conductive silver-TPU inks achieving conductivities up to 3x10⁶ S/m with robotic pick-and-place assembly. This approach enables fabrication of soft electronic devices including wearable strain sensors and microcontroller systems. Systematic characterization reveals that selective TPU reinforcement around rigid components extends their composite electromechanical strain tolerance sevenfold, from 17% to 120%. Building upon these insights, a novel droplet-based viscoelastic ink printing (DVIP) method is introduced, capable of spatially patterning multiple photocurable thiol-ene elastomers, with moduli spanning three orders of magnitude, through raster image processing. Integration of robotic assembly and printable liquid metal inks enables scalable fabrication of personalized stretchable devices with spatially programmable mechanical gradients surrounding embedded components. Devices incorporating zonally graded strain relief demonstrate 100-fold improvement in electrical fatigue life compared to uniform matrices, surviving 5000 strain cycles versus 50. The versatility of DVIP is further demonstrated through multi-layer architectures incorporating printed variable capacitance sensors, vertical interconnects, and selectively encapsulated circuit modules, establishing a scalable pathway for the digital printing of next-generation biointegrated electronics.
■590 ▼aSchool code: 0084.
■650 4▼aMechanical engineering
■650 4▼aMaterials science
■650 4▼aEngineering
■650 4▼aElectrical engineering
■653 ▼a3D printing
■653 ▼aAdditive manufacturing
■653 ▼aDirect ink writing
■653 ▼aElastomers
■653 ▼aInkjet
■653 ▼aStretchable electronics
■690 ▼a0794
■690 ▼a0548
■690 ▼a0544
■690 ▼a0537
■71020▼aHarvard University▼bEngineering and Applied Sciences - Engineering Sciences.
■7730 ▼tDissertations Abstracts International▼g87-05B.
■790 ▼a0084
■791 ▼aPh.D.
■792 ▼a2025
■793 ▼aEnglish
■85640▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T17359559▼nKERIS▼z이 자료의 원문은 한국교육학술정보원에서 제공합니다.
