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Strain Localization and Electrical Resistance Evolution in Ag Flake-Based Nanocomposite Inks Under Monotonic and Cyclic Stretching
Strain Localization and Electrical Resistance Evolution in Ag Flake-Based Nanocomposite Inks Under Monotonic and Cyclic Stretching
상세정보
- 자료유형
- 학위논문 서양
- 최종처리일시
- 20260202105520
- ISBN
- 9798263344009
- DDC
- 600
- 저자명
- Li, Qiushi.
- 서명/저자
- Strain Localization and Electrical Resistance Evolution in Ag Flake-Based Nanocomposite Inks Under Monotonic and Cyclic Stretching
- 발행사항
- [Sl] : Georgia Institute of Technology, 2024
- 발행사항
- Ann Arbor : ProQuest Dissertations & Theses, 2024
- 형태사항
- 257 p
- 주기사항
- Source: Dissertations Abstracts International, Volume: 87-05, Section: B.
- 주기사항
- Advisor: Antoniou, Antonia;Pierron, Olivier N.
- 학위논문주기
- Thesis (Ph.D.)--Georgia Institute of Technology, 2024.
- 초록/해제
- 요약Flexible electronics devices (FHE) consist of thin electronic components mounted on flexible polymer substrates, enabling the device to perform electrically while deformed. For FHE devices, the interconnect must be designed to maintain electrical conductivity within the expected range of deformation which is often repetitive in practical use. One class of emerging interconnect materials is the nanocomposite conductors with nanoparticles (such as submicron metal flakes, nanowires, nanotubes, and small nm-sized particles) enclosed in stretchable binders. This dissertation studies two types of nanocomposite conductors, also known as conductive inks, employing Ag flakes enclosed in polymer binder materials and screen printed on thicker polymer substrates. One ink type is the DuPont PE874 ink with a polyurethane binder and significant porosity, which is typically printed on a thermoplastic polyurethane (TPU) substrate. The other ink type is the DuPont 5025 ink with an acrylic binder and no porosity, which is typically printed on a polyimide (PI) substrate. The PE874 ink was designed for stretchable applications while the 5025 ink was designed for flexible applications.In previous research, the electrical resistance measured during the uniaxial stretching of the conductive inks far exceed model predictions based on uniform material deformation, confirming that strain localization plays a dominant role in ink resistance increase under uniaxial strain. This dissertation investigates the following topics regarding ink strain localization: 1) the origins of strain localization, 2) the material and structural dimension factors affecting strain localization, and 3) the relationship between strain localization and resistance increase under monotonic and cyclic uniaxial strain. In addition, the key empirical parameters for characterizing ink fatigue behavior are investigated and used to construct an empirical model for predicting resistance increase with cyclic stretching.The origins of strain localization are hypothesized as 1) the ink surface roughness and 2) local variations in Ag flake concentration (measured by volume fraction). Two-dimensional finite element models incorporating both factors are constructed to study their roles in causing strain localization. The models found that while both factors could cause significant strain localization, surface roughness is the more dominant factor. Some initial results from uniaxial stretch experiments with in situ scanning electron microscope (SEM) imaging and FIB cross-section cuts showed that both factors could cause strain localization.Monotonic and cyclic uniaxial stretch experiments with synchronous resistance measurements were used to test straight trace line specimens. Straight trace line specimens were used in the experiments rather than more complex designs such as serpentine patterns due to their geometric simplicity, which facilitates the characterization and analysis of strain localization. The study of structural dimensions focused on the trace line width and thickness effects for the PE874 ink and was aided by experiments with confocal microscope (CM) imaging. For both monotonic and cyclic stretching, narrower widths (≤0.5 mm) and thicker ink layers (10 μm) were found to have higher normalized resistance R/R0, though for the case of thickness the higher R/R0 could be offset by a lower initial resistance due to the higher thickness.
- 일반주제명
- Polymers
- 일반주제명
- Tension tests
- 일반주제명
- Nanocomposites
- 일반주제명
- Silver
- 일반주제명
- Yield stress
- 일반주제명
- Design
- 일반주제명
- Ion beams
- 일반주제명
- Cracks
- 일반주제명
- Deformation
- 일반주제명
- Shear strain
- 일반주제명
- Composite materials
- 일반주제명
- Materials science
- 일반주제명
- Nanotechnology
- 일반주제명
- Polymer chemistry
- 기본자료저록
- Dissertations Abstracts International. 87-05B.
- 전자적 위치 및 접속
- 로그인 후 원문을 볼 수 있습니다.
MARC
008260126s2024 us c eng d■001000017360409
■00520260202105520
■006m o d
■007cr#unu||||||||
■020 ▼a9798263344009
■035 ▼a(MiAaPQ)AAI32309520
■035 ▼a(MiAaPQ)GeorgiaTech76993
■040 ▼aMiAaPQ▼cMiAaPQ
■0820 ▼a600
■1001 ▼aLi, Qiushi.
■24510▼aStrain Localization and Electrical Resistance Evolution in Ag Flake-Based Nanocomposite Inks Under Monotonic and Cyclic Stretching
■260 ▼a[Sl]▼bGeorgia Institute of Technology▼c2024
■260 1▼aAnn Arbor▼bProQuest Dissertations & Theses▼c2024
■300 ▼a257 p
■500 ▼aSource: Dissertations Abstracts International, Volume: 87-05, Section: B.
■500 ▼aAdvisor: Antoniou, Antonia;Pierron, Olivier N.
■5021 ▼aThesis (Ph.D.)--Georgia Institute of Technology, 2024.
■520 ▼aFlexible electronics devices (FHE) consist of thin electronic components mounted on flexible polymer substrates, enabling the device to perform electrically while deformed. For FHE devices, the interconnect must be designed to maintain electrical conductivity within the expected range of deformation which is often repetitive in practical use. One class of emerging interconnect materials is the nanocomposite conductors with nanoparticles (such as submicron metal flakes, nanowires, nanotubes, and small nm-sized particles) enclosed in stretchable binders. This dissertation studies two types of nanocomposite conductors, also known as conductive inks, employing Ag flakes enclosed in polymer binder materials and screen printed on thicker polymer substrates. One ink type is the DuPont PE874 ink with a polyurethane binder and significant porosity, which is typically printed on a thermoplastic polyurethane (TPU) substrate. The other ink type is the DuPont 5025 ink with an acrylic binder and no porosity, which is typically printed on a polyimide (PI) substrate. The PE874 ink was designed for stretchable applications while the 5025 ink was designed for flexible applications.In previous research, the electrical resistance measured during the uniaxial stretching of the conductive inks far exceed model predictions based on uniform material deformation, confirming that strain localization plays a dominant role in ink resistance increase under uniaxial strain. This dissertation investigates the following topics regarding ink strain localization: 1) the origins of strain localization, 2) the material and structural dimension factors affecting strain localization, and 3) the relationship between strain localization and resistance increase under monotonic and cyclic uniaxial strain. In addition, the key empirical parameters for characterizing ink fatigue behavior are investigated and used to construct an empirical model for predicting resistance increase with cyclic stretching.The origins of strain localization are hypothesized as 1) the ink surface roughness and 2) local variations in Ag flake concentration (measured by volume fraction). Two-dimensional finite element models incorporating both factors are constructed to study their roles in causing strain localization. The models found that while both factors could cause significant strain localization, surface roughness is the more dominant factor. Some initial results from uniaxial stretch experiments with in situ scanning electron microscope (SEM) imaging and FIB cross-section cuts showed that both factors could cause strain localization.Monotonic and cyclic uniaxial stretch experiments with synchronous resistance measurements were used to test straight trace line specimens. Straight trace line specimens were used in the experiments rather than more complex designs such as serpentine patterns due to their geometric simplicity, which facilitates the characterization and analysis of strain localization. The study of structural dimensions focused on the trace line width and thickness effects for the PE874 ink and was aided by experiments with confocal microscope (CM) imaging. For both monotonic and cyclic stretching, narrower widths (≤0.5 mm) and thicker ink layers (10 μm) were found to have higher normalized resistance R/R0, though for the case of thickness the higher R/R0 could be offset by a lower initial resistance due to the higher thickness.
■590 ▼aSchool code: 0078.
■650 4▼aPolymers
■650 4▼aTension tests
■650 4▼aPolyethylene terephthalate
■650 4▼aNanocomposites
■650 4▼aSilver
■650 4▼aYield stress
■650 4▼aDesign
■650 4▼aIon beams
■650 4▼aCracks
■650 4▼aDeformation
■650 4▼aShear strain
■650 4▼aComposite materials
■650 4▼aMaterials science
■650 4▼aNanotechnology
■650 4▼aPolymer chemistry
■690 ▼a0389
■690 ▼a0794
■690 ▼a0652
■690 ▼a0495
■71020▼aGeorgia Institute of Technology.
■7730 ▼tDissertations Abstracts International▼g87-05B.
■790 ▼a0078
■791 ▼aPh.D.
■792 ▼a2024
■793 ▼aEnglish
■85640▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T17360409▼nKERIS▼z이 자료의 원문은 한국교육학술정보원에서 제공합니다.


