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Strain Localization and Electrical Resistance Evolution in Ag Flake-Based Nanocomposite Inks Under Monotonic and Cyclic Stretching
Strain Localization and Electrical Resistance Evolution in Ag Flake-Based Nanocomposite In...
Strain Localization and Electrical Resistance Evolution in Ag Flake-Based Nanocomposite Inks Under Monotonic and Cyclic Stretching

Detailed Information

자료유형  
 학위논문 서양
최종처리일시  
20260202105520
ISBN  
9798263344009
DDC  
600
저자명  
Li, Qiushi.
서명/저자  
Strain Localization and Electrical Resistance Evolution in Ag Flake-Based Nanocomposite Inks Under Monotonic and Cyclic Stretching
발행사항  
[Sl] : Georgia Institute of Technology, 2024
발행사항  
Ann Arbor : ProQuest Dissertations & Theses, 2024
형태사항  
257 p
주기사항  
Source: Dissertations Abstracts International, Volume: 87-05, Section: B.
주기사항  
Advisor: Antoniou, Antonia;Pierron, Olivier N.
학위논문주기  
Thesis (Ph.D.)--Georgia Institute of Technology, 2024.
초록/해제  
요약Flexible electronics devices (FHE) consist of thin electronic components mounted on flexible polymer substrates, enabling the device to perform electrically while deformed. For FHE devices, the interconnect must be designed to maintain electrical conductivity within the expected range of deformation which is often repetitive in practical use. One class of emerging interconnect materials is the nanocomposite conductors with nanoparticles (such as submicron metal flakes, nanowires, nanotubes, and small nm-sized particles) enclosed in stretchable binders. This dissertation studies two types of nanocomposite conductors, also known as conductive inks, employing Ag flakes enclosed in polymer binder materials and screen printed on thicker polymer substrates. One ink type is the DuPont PE874 ink with a polyurethane binder and significant porosity, which is typically printed on a thermoplastic polyurethane (TPU) substrate. The other ink type is the DuPont 5025 ink with an acrylic binder and no porosity, which is typically printed on a polyimide (PI) substrate. The PE874 ink was designed for stretchable applications while the 5025 ink was designed for flexible applications.In previous research, the electrical resistance measured during the uniaxial stretching of the conductive inks far exceed model predictions based on uniform material deformation, confirming that strain localization plays a dominant role in ink resistance increase under uniaxial strain. This dissertation investigates the following topics regarding ink strain localization: 1) the origins of strain localization, 2) the material and structural dimension factors affecting strain localization, and 3) the relationship between strain localization and resistance increase under monotonic and cyclic uniaxial strain. In addition, the key empirical parameters for characterizing ink fatigue behavior are investigated and used to construct an empirical model for predicting resistance increase with cyclic stretching.The origins of strain localization are hypothesized as 1) the ink surface roughness and 2) local variations in Ag flake concentration (measured by volume fraction). Two-dimensional finite element models incorporating both factors are constructed to study their roles in causing strain localization. The models found that while both factors could cause significant strain localization, surface roughness is the more dominant factor. Some initial results from uniaxial stretch experiments with in situ scanning electron microscope (SEM) imaging and FIB cross-section cuts showed that both factors could cause strain localization.Monotonic and cyclic uniaxial stretch experiments with synchronous resistance measurements were used to test straight trace line specimens. Straight trace line specimens were used in the experiments rather than more complex designs such as serpentine patterns due to their geometric simplicity, which facilitates the characterization and analysis of strain localization. The study of structural dimensions focused on the trace line width and thickness effects for the PE874 ink and was aided by experiments with confocal microscope (CM) imaging. For both monotonic and cyclic stretching, narrower widths (≤0.5 mm) and thicker ink layers (10 μm) were found to have higher normalized resistance R/R0, though for the case of thickness the higher R/R0 could be offset by a lower initial resistance due to the higher thickness.
일반주제명  
Polymers
일반주제명  
Tension tests
일반주제명  
Polyethylene terephthalate
일반주제명  
Nanocomposites
일반주제명  
Silver
일반주제명  
Yield stress
일반주제명  
Design
일반주제명  
Ion beams
일반주제명  
Cracks
일반주제명  
Deformation
일반주제명  
Shear strain
일반주제명  
Composite materials
일반주제명  
Materials science
일반주제명  
Nanotechnology
일반주제명  
Polymer chemistry
기타저자  
Georgia Institute of Technology.
기본자료저록  
Dissertations Abstracts International. 87-05B.
전자적 위치 및 접속  
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MARC

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■035    ▼a(MiAaPQ)GeorgiaTech76993
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■0820  ▼a600
■1001  ▼aLi,  Qiushi.
■24510▼aStrain  Localization  and  Electrical  Resistance  Evolution  in  Ag  Flake-Based  Nanocomposite  Inks  Under  Monotonic  and  Cyclic  Stretching
■260    ▼a[Sl]▼bGeorgia  Institute  of  Technology▼c2024
■260  1▼aAnn  Arbor▼bProQuest  Dissertations  &  Theses▼c2024
■300    ▼a257  p
■500    ▼aSource:  Dissertations  Abstracts  International,  Volume:  87-05,  Section:  B.
■500    ▼aAdvisor:  Antoniou,  Antonia;Pierron,  Olivier  N.
■5021  ▼aThesis  (Ph.D.)--Georgia  Institute  of  Technology,  2024.
■520    ▼aFlexible  electronics  devices  (FHE)  consist  of  thin  electronic  components  mounted  on  flexible  polymer  substrates,  enabling  the  device  to  perform  electrically  while  deformed.  For  FHE  devices,  the  interconnect  must  be  designed  to  maintain  electrical  conductivity  within  the  expected  range  of  deformation  which  is  often  repetitive  in  practical  use.  One  class  of  emerging  interconnect  materials  is  the  nanocomposite  conductors  with  nanoparticles  (such  as  submicron  metal  flakes,  nanowires,  nanotubes,  and  small  nm-sized  particles)  enclosed  in  stretchable  binders.  This  dissertation  studies  two  types  of  nanocomposite  conductors,  also  known  as  conductive  inks,  employing  Ag  flakes  enclosed  in  polymer  binder  materials  and  screen  printed  on  thicker  polymer  substrates.  One  ink  type  is  the  DuPont  PE874  ink  with  a  polyurethane  binder  and  significant  porosity,  which  is  typically  printed  on  a  thermoplastic  polyurethane  (TPU)  substrate.  The  other  ink  type  is  the  DuPont  5025  ink  with  an  acrylic  binder  and  no  porosity,  which  is  typically  printed  on  a  polyimide  (PI)  substrate.  The  PE874  ink  was  designed  for  stretchable  applications  while  the  5025  ink  was  designed  for  flexible  applications.In  previous  research,  the  electrical  resistance  measured  during  the  uniaxial  stretching  of  the  conductive  inks  far  exceed  model  predictions  based  on  uniform  material  deformation,  confirming  that  strain  localization  plays  a  dominant  role  in  ink  resistance  increase  under  uniaxial  strain.  This  dissertation  investigates  the  following  topics  regarding  ink  strain  localization:  1)  the  origins  of  strain  localization,  2)  the  material  and  structural  dimension  factors  affecting  strain  localization,  and  3)  the  relationship  between  strain  localization  and  resistance  increase  under  monotonic  and  cyclic  uniaxial  strain.  In  addition,  the  key  empirical  parameters  for  characterizing  ink  fatigue  behavior  are  investigated  and  used  to  construct  an  empirical  model  for  predicting  resistance  increase  with  cyclic  stretching.The  origins  of  strain  localization  are  hypothesized  as  1)  the  ink  surface  roughness  and  2)  local  variations  in  Ag  flake  concentration  (measured  by  volume  fraction).  Two-dimensional  finite  element  models  incorporating  both  factors  are  constructed  to  study  their  roles  in  causing  strain  localization.  The  models  found  that  while  both  factors  could  cause  significant  strain  localization,  surface  roughness  is  the  more  dominant  factor.  Some  initial  results  from  uniaxial  stretch  experiments  with  in  situ  scanning  electron  microscope  (SEM)  imaging  and  FIB  cross-section  cuts  showed  that  both  factors  could  cause  strain  localization.Monotonic  and  cyclic  uniaxial  stretch  experiments  with  synchronous  resistance  measurements  were  used  to  test  straight  trace  line  specimens.  Straight  trace  line  specimens  were  used  in  the  experiments  rather  than  more  complex  designs  such  as  serpentine  patterns  due  to  their  geometric  simplicity,  which  facilitates  the  characterization  and  analysis  of  strain  localization.  The  study  of  structural  dimensions  focused  on  the  trace  line  width  and  thickness  effects  for  the  PE874  ink  and  was  aided  by  experiments  with  confocal  microscope  (CM)  imaging.  For  both  monotonic  and  cyclic  stretching,  narrower  widths  (≤0.5  mm)  and  thicker  ink  layers  (10  μm)  were  found  to  have  higher  normalized  resistance  R/R0,  though  for  the  case  of  thickness  the  higher  R/R0  could  be  offset  by  a  lower  initial  resistance  due  to  the  higher  thickness.
■590    ▼aSchool  code:  0078.
■650  4▼aPolymers
■650  4▼aTension  tests
■650  4▼aPolyethylene  terephthalate
■650  4▼aNanocomposites
■650  4▼aSilver
■650  4▼aYield  stress
■650  4▼aDesign
■650  4▼aIon  beams
■650  4▼aCracks
■650  4▼aDeformation
■650  4▼aShear  strain
■650  4▼aComposite  materials
■650  4▼aMaterials  science
■650  4▼aNanotechnology
■650  4▼aPolymer  chemistry
■690    ▼a0389
■690    ▼a0794
■690    ▼a0652
■690    ▼a0495
■71020▼aGeorgia  Institute  of  Technology.
■7730  ▼tDissertations  Abstracts  International▼g87-05B.
■790    ▼a0078
■791    ▼aPh.D.
■792    ▼a2024
■793    ▼aEnglish
■85640▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T17360409▼nKERIS▼z이  자료의  원문은  한국교육학술정보원에서  제공합니다.

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