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Enhancement of Boiling and Evaporation Heat Transfer Through Surface Structure Design for Two-Phase Thermal Management
Enhancement of Boiling and Evaporation Heat Transfer Through Surface Structure Design for ...
Enhancement of Boiling and Evaporation Heat Transfer Through Surface Structure Design for Two-Phase Thermal Management

Detailed Information

자료유형  
 학위논문 서양
최종처리일시  
20260202105241
ISBN  
9798291569283
DDC  
620
저자명  
Zhou, Yimin.
서명/저자  
Enhancement of Boiling and Evaporation Heat Transfer Through Surface Structure Design for Two-Phase Thermal Management
발행사항  
[Sl] : University of Michigan, 2025
발행사항  
Ann Arbor : ProQuest Dissertations & Theses, 2025
형태사항  
121 p
주기사항  
Source: Dissertations Abstracts International, Volume: 87-03, Section: B.
주기사항  
Advisor: Adera, Solomon.
학위논문주기  
Thesis (Ph.D.)--University of Michigan, 2025.
초록/해제  
요약The rapid rise in power density in modern electronics, from microprocessors to data centers, demands advanced thermal management strategies capable of removing high heat fluxes from confined areas. Two-phase cooling methods that use liquid-to-vapor phase change are promising because of their large latent heat and high heat transfer coefficient. This thesis examines boiling and thin-film evaporation as thermal management solutions, focusing on improving performance through engineered surfaces.In the first part of the thesis, we designed and built an experimental setup for saturated pool boiling of de-ionized water on copper surfaces. In particular, oil-impregnated surfaces were studied to understand how the presence of a lubricating layer influences bubble dynamics and heat transfer performance. High-speed visualization showed that bubbles on oil-impregnated surfaces had an average departure diameter about 60 % larger and a residence time about 70 % longer than bubbles on corresponding surfaces without lubricant. The annular wetting ridge and wrapping layer play a crucial role in delaying bubble coalescence and increasing departure diameter. The critical heat flux (CHF) on oil-impregnated surfaces was ≈28-36 W/cm2, comparable to that of the counterpart surface without oil (≈27 W/cm2). This result is attributed to oil depletion, which rendered the oil-impregnated surfaces superhydrophobic, as confirmed by surface characterization after boiling. This work provides new insights into oil depletion mechanisms and highlights potential pathways for improving surface durability and performance under boiling conditions.The second part of this thesis focuses on enhancing pool boiling heat transfer in saturated deionized water using re-entrant silicon microcavity structures. A custom experimental setup based on thin-film (≈100 nm) heater on the back side of the silicon sample was designed and built. Re-entrant microcavities with oxide cap thicknesses of 2 µm, 1 µm, and 0.5 µm, and vertical microcavities were fabricated on silicon surfaces. The re-entrant microcavities triggered nucleate boiling at a lower superheat than the vertical microcavities. The re-entrant surfaces with a 2 µm thick cap achieved the highest critical heat flux (CHF) of ≈156 W/cm2, corresponding to a ≈117 % increase over vertical cavities and a ≈58 % increase over flat surfaces. This demonstrates that the re-entrant microgeometry strongly enhances boiling heat transfer. The re-entrant surfaces with 1 µm and 0.5 µm caps reached a CHF of ≈142 W/cm2 and ≈136 W/cm2, respectively, showing that increasing the capping layer thickness improves the CHF for re-entrant microcavity surfaces. These results underscore the significant influence of microscale surface geometry on boiling heat transfer.In the third part of the thesis, we develop and validate a numerical framework to model capillary-limited thin-film evaporation of water from well-defined silicon micropillar wicks. Using a combination of the Young-Laplace equation and conservation laws, the model predicts liquid pressure, meniscus shape, and dry-out heat flux under steady-state conditions. The model is validated using published experimental data. When fixing the micropillar spacing and height, we optimized the distribution of micropillar diameter along the evaporator wick using genetic algorithms for maximum dry-out heat flux. We show that variable-density wicks with sparse pillars near the reservoir and dense pillars near the hotspot can enhance the dry-out heat flux by up to 96% (≈165 W/cm2), compared to uniform wicks (≈84 W/cm2).Together, these studies improve understanding of two-phase transport on structured surfaces and provide strategies for improving boiling and evaporation for thermal management. The results are directly relevant to next-generation cooling systems for high-performance, power-dense electronics.
일반주제명  
Engineering
일반주제명  
Mechanical engineering
일반주제명  
Thermodynamics
키워드  
Heat transfer
키워드  
Thermal management
키워드  
Two-phase liquid cooling
키워드  
Pool boiling
키워드  
Thin-film evaporation
키워드  
Surface engineering
기타저자  
University of Michigan Mechanical Engineering
기본자료저록  
Dissertations Abstracts International. 87-03B.
전자적 위치 및 접속  
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MARC

 008260126s2025        us                              c    eng  d
■001000017359956
■00520260202105241
■006m          o    d                
■007cr#unu||||||||
■020    ▼a9798291569283
■035    ▼a(MiAaPQ)AAI32272002
■035    ▼a(MiAaPQ)umichrackham006519
■040    ▼aMiAaPQ▼cMiAaPQ
■0820  ▼a620
■1001  ▼aZhou,  Yimin.
■24510▼aEnhancement  of  Boiling  and  Evaporation  Heat  Transfer  Through  Surface  Structure  Design  for  Two-Phase  Thermal  Management
■260    ▼a[Sl]▼bUniversity  of  Michigan▼c2025
■260  1▼aAnn  Arbor▼bProQuest  Dissertations  &  Theses▼c2025
■300    ▼a121  p
■500    ▼aSource:  Dissertations  Abstracts  International,  Volume:  87-03,  Section:  B.
■500    ▼aAdvisor:  Adera,  Solomon.
■5021  ▼aThesis  (Ph.D.)--University  of  Michigan,  2025.
■520    ▼aThe  rapid  rise  in  power  density  in  modern  electronics,  from  microprocessors  to  data  centers,  demands  advanced  thermal  management  strategies  capable  of  removing  high  heat  fluxes  from  confined  areas.  Two-phase  cooling  methods  that  use  liquid-to-vapor  phase  change  are  promising  because  of  their  large  latent  heat  and  high  heat  transfer  coefficient.  This  thesis  examines  boiling  and  thin-film  evaporation  as  thermal  management  solutions,  focusing  on  improving  performance  through  engineered  surfaces.In  the  first  part  of  the  thesis,  we  designed  and  built  an  experimental  setup  for  saturated  pool  boiling  of  de-ionized  water  on  copper  surfaces.  In  particular,  oil-impregnated  surfaces  were  studied  to  understand  how  the  presence  of  a  lubricating  layer  influences  bubble  dynamics  and  heat  transfer  performance.  High-speed  visualization  showed  that  bubbles  on  oil-impregnated  surfaces  had  an  average  departure  diameter  about  60 %  larger  and  a  residence  time  about  70 %  longer  than  bubbles  on  corresponding  surfaces  without  lubricant.  The  annular  wetting  ridge  and  wrapping  layer  play  a  crucial  role  in  delaying  bubble  coalescence  and  increasing  departure  diameter.  The  critical  heat  flux  (CHF)  on  oil-impregnated  surfaces  was  ≈28-36  W/cm2,  comparable  to  that  of  the  counterpart  surface  without  oil  (≈27  W/cm2).  This  result  is  attributed  to  oil  depletion,  which  rendered  the  oil-impregnated  surfaces  superhydrophobic,  as  confirmed  by  surface  characterization  after  boiling.  This  work  provides  new  insights  into  oil  depletion  mechanisms  and  highlights  potential  pathways  for  improving  surface  durability  and  performance  under  boiling  conditions.The  second  part  of  this  thesis  focuses  on  enhancing  pool  boiling  heat  transfer  in  saturated  deionized  water  using  re-entrant  silicon  microcavity  structures.  A  custom  experimental  setup  based  on  thin-film  (≈100  nm)  heater  on  the  back  side  of  the  silicon  sample  was  designed  and  built.  Re-entrant  microcavities  with  oxide  cap  thicknesses  of  2 µm,  1 µm,  and  0.5 µm,  and  vertical  microcavities  were  fabricated  on  silicon  surfaces.  The  re-entrant  microcavities  triggered  nucleate  boiling  at  a  lower  superheat  than  the  vertical  microcavities.  The  re-entrant  surfaces  with  a  2 µm  thick  cap  achieved  the  highest  critical  heat  flux  (CHF)  of  ≈156 W/cm2,  corresponding  to  a  ≈117 %  increase  over  vertical  cavities  and  a  ≈58 %  increase  over  flat  surfaces.  This  demonstrates  that  the re-entrant  microgeometry  strongly  enhances  boiling  heat  transfer.  The  re-entrant  surfaces  with  1 µm  and  0.5 µm  caps  reached  a  CHF  of  ≈142 W/cm2  and  ≈136 W/cm2,  respectively,  showing  that  increasing  the  capping  layer  thickness  improves  the  CHF  for  re-entrant  microcavity  surfaces.  These  results  underscore  the  significant  influence  of  microscale  surface  geometry  on  boiling  heat  transfer.In  the  third  part  of  the  thesis,  we  develop  and  validate  a  numerical  framework  to  model  capillary-limited  thin-film  evaporation  of  water  from  well-defined  silicon  micropillar  wicks.  Using  a  combination  of  the  Young-Laplace  equation  and  conservation  laws,  the  model  predicts  liquid  pressure,  meniscus  shape,  and  dry-out  heat  flux  under  steady-state  conditions.  The  model  is  validated  using  published  experimental  data.  When  fixing  the  micropillar  spacing  and  height,  we  optimized  the  distribution  of  micropillar  diameter  along  the  evaporator  wick  using  genetic  algorithms  for  maximum  dry-out  heat  flux.  We  show  that  variable-density  wicks  with  sparse  pillars  near  the  reservoir  and  dense  pillars  near  the  hotspot  can  enhance  the  dry-out  heat  flux  by  up  to  96%  (≈165  W/cm2),  compared  to  uniform  wicks  (≈84  W/cm2).Together,  these  studies  improve  understanding  of  two-phase  transport  on  structured  surfaces  and  provide  strategies  for  improving  boiling  and  evaporation  for  thermal  management.  The  results  are  directly  relevant  to  next-generation  cooling  systems  for  high-performance,  power-dense  electronics.
■590    ▼aSchool  code:  0127.
■650  4▼aEngineering
■650  4▼aMechanical  engineering
■650  4▼aThermodynamics
■653    ▼aHeat  transfer
■653    ▼aThermal  management
■653    ▼aTwo-phase  liquid  cooling
■653    ▼aPool  boiling
■653    ▼aThin-film  evaporation
■653    ▼aSurface  engineering
■690    ▼a0537
■690    ▼a0548
■690    ▼a0348
■71020▼aUniversity  of  Michigan▼bMechanical  Engineering.
■7730  ▼tDissertations  Abstracts  International▼g87-03B.
■790    ▼a0127
■791    ▼aPh.D.
■792    ▼a2025
■793    ▼aEnglish
■85640▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T17359956▼nKERIS▼z이  자료의  원문은  한국교육학술정보원에서  제공합니다.

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