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From Silicon to Neurons: Designing Three-Dimensional Microelectronic Interfaces for Targeted, High-Density, and Large-Scale Neural Signal Readout
From Silicon to Neurons: Designing Three-Dimensional Microelectronic Interfaces for Target...
From Silicon to Neurons: Designing Three-Dimensional Microelectronic Interfaces for Targeted, High-Density, and Large-Scale Neural Signal Readout

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자료유형  
 학위논문 서양
최종처리일시  
20260202105622
ISBN  
9798265427373
DDC  
620
저자명  
Wang, Pingyu.
서명/저자  
From Silicon to Neurons: Designing Three-Dimensional Microelectronic Interfaces for Targeted, High-Density, and Large-Scale Neural Signal Readout
발행사항  
[Sl] : Stanford University, 2024
발행사항  
Ann Arbor : ProQuest Dissertations & Theses, 2024
형태사항  
114 p
주기사항  
Source: Dissertations Abstracts International, Volume: 87-05, Section: A.
주기사항  
Advisor: Melosh, Nicholas.
학위논문주기  
Thesis (Ph.D.)--Stanford University, 2024.
초록/해제  
요약Silicon-based microelectronic arrays (Si-MEA) can scalably record and modulate neural activity at high spatiotemporal resolution, but their planar form factor poses challenges in targeting three-dimensional (3D) neural structures. This dissertation presents novel approaches to interface Si-MEA with neural tissues. A method is first presented that builds upon previous work in integrating massively parallel microwire bundles with Si-MEA. To miniaturize the device footprint, the flip-chip bonding technique was extended to establish reliable, large-scale, and individual electrical contacts between the microwire bundle and Si-MEA.Next, a direct-print method is introduced for fabricating microelectrodes on top of Si-MEA. Leveraging 2-photon polymerization and scalable microfabrication technologies, this method allowed scalable fabrication of microelectrode arrays with customizable positioning, shapes, and heights, facilitating precise targeting of neuron populations distributed in 3D. The effectiveness of this approach in interfacing with the retina was demonstrated through selectively targeting retinal ganglion cell (RGC) somas while mitigating interference from axon bundles. The method achieved high-fidelity, high-resolution, and large-scale RGC recording with significantly reduced axonal interference, demonstrating previously unattained capabilities. Such advancements hold the promise of interfacing Si-MEA to various parts of the nervous system, unlocking new avenues for neuroscience research and therapeutic interventions.
일반주제명  
Silicon
일반주제명  
Neurons
일반주제명  
Investigations
일반주제명  
Electrodes
일반주제명  
Semiconductors
일반주제명  
Prostheses
일반주제명  
Macular degeneration
일반주제명  
Retina
일반주제명  
Brain research
일반주제명  
Polymerization
일반주제명  
Plasma etching
일반주제명  
Light emitting diodes
일반주제명  
Design
일반주제명  
Neurosciences
일반주제명  
CMOS
일반주제명  
Nervous system
일반주제명  
Photoreceptors
일반주제명  
Electrical engineering
일반주제명  
Ophthalmology
일반주제명  
Optics
일반주제명  
Polymer chemistry
기타저자  
Stanford University.
기본자료저록  
Dissertations Abstracts International. 87-05A.
전자적 위치 및 접속  
로그인 후 원문을 볼 수 있습니다.

MARC

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■0820  ▼a620
■1001  ▼aWang,  Pingyu.
■24510▼aFrom  Silicon  to  Neurons:  Designing  Three-Dimensional  Microelectronic  Interfaces  for  Targeted,  High-Density,  and  Large-Scale  Neural  Signal  Readout
■260    ▼a[Sl]▼bStanford  University▼c2024
■260  1▼aAnn  Arbor▼bProQuest  Dissertations  &  Theses▼c2024
■300    ▼a114  p
■500    ▼aSource:  Dissertations  Abstracts  International,  Volume:  87-05,  Section:  A.
■500    ▼aAdvisor:  Melosh,  Nicholas.
■5021  ▼aThesis  (Ph.D.)--Stanford  University,  2024.
■520    ▼aSilicon-based  microelectronic  arrays  (Si-MEA)  can  scalably  record  and  modulate  neural  activity  at  high  spatiotemporal  resolution,  but  their  planar  form  factor  poses  challenges  in  targeting  three-dimensional  (3D)  neural  structures.  This  dissertation  presents  novel  approaches  to  interface  Si-MEA  with  neural  tissues.  A  method  is  first  presented  that  builds  upon  previous  work  in  integrating  massively  parallel  microwire  bundles  with  Si-MEA.  To  miniaturize  the  device  footprint,  the  flip-chip  bonding  technique  was  extended  to  establish  reliable,  large-scale,  and  individual  electrical  contacts  between  the  microwire  bundle  and  Si-MEA.Next,  a  direct-print  method  is  introduced  for  fabricating  microelectrodes  on  top  of  Si-MEA.  Leveraging  2-photon  polymerization  and  scalable  microfabrication  technologies,  this  method  allowed  scalable  fabrication  of  microelectrode  arrays  with  customizable  positioning,  shapes,  and  heights,  facilitating  precise  targeting  of  neuron  populations  distributed  in  3D.  The  effectiveness  of  this  approach  in  interfacing  with  the  retina  was  demonstrated  through  selectively  targeting  retinal  ganglion  cell  (RGC)  somas  while  mitigating  interference  from  axon  bundles.  The  method  achieved  high-fidelity,  high-resolution,  and  large-scale  RGC  recording  with  significantly  reduced  axonal  interference,  demonstrating  previously  unattained  capabilities.  Such  advancements  hold  the  promise  of  interfacing  Si-MEA  to  various  parts  of  the  nervous  system,  unlocking  new  avenues  for  neuroscience  research  and  therapeutic  interventions.
■590    ▼aSchool  code:  0212.
■650  4▼aSilicon
■650  4▼aNeurons
■650  4▼aInvestigations
■650  4▼aElectrodes
■650  4▼aSemiconductors
■650  4▼aProstheses
■650  4▼aMacular  degeneration
■650  4▼aRetina
■650  4▼aBrain  research
■650  4▼aPolymerization
■650  4▼aPlasma  etching
■650  4▼aLight  emitting  diodes
■650  4▼aDesign
■650  4▼aNeurosciences
■650  4▼aCMOS
■650  4▼aNervous  system
■650  4▼aPhotoreceptors
■650  4▼aElectrical  engineering
■650  4▼aOphthalmology
■650  4▼aOptics
■650  4▼aPolymer  chemistry
■690    ▼a0389
■690    ▼a0317
■690    ▼a0544
■690    ▼a0381
■690    ▼a0752
■690    ▼a0495
■71020▼aStanford  University.
■7730  ▼tDissertations  Abstracts  International▼g87-05A.
■790    ▼a0212
■791    ▼aPh.D.
■792    ▼a2024
■793    ▼aEnglish
■85640▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T17360810▼nKERIS▼z이  자료의  원문은  한국교육학술정보원에서  제공합니다.

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