서브메뉴
검색
From Silicon to Neurons: Designing Three-Dimensional Microelectronic Interfaces for Targeted, High-Density, and Large-Scale Neural Signal Readout
From Silicon to Neurons: Designing Three-Dimensional Microelectronic Interfaces for Targeted, High-Density, and Large-Scale Neural Signal Readout
상세정보
- 자료유형
- 학위논문 서양
- 최종처리일시
- 20260202105622
- ISBN
- 9798265427373
- DDC
- 620
- 저자명
- Wang, Pingyu.
- 서명/저자
- From Silicon to Neurons: Designing Three-Dimensional Microelectronic Interfaces for Targeted, High-Density, and Large-Scale Neural Signal Readout
- 발행사항
- [Sl] : Stanford University, 2024
- 발행사항
- Ann Arbor : ProQuest Dissertations & Theses, 2024
- 형태사항
- 114 p
- 주기사항
- Source: Dissertations Abstracts International, Volume: 87-05, Section: A.
- 주기사항
- Advisor: Melosh, Nicholas.
- 학위논문주기
- Thesis (Ph.D.)--Stanford University, 2024.
- 초록/해제
- 요약Silicon-based microelectronic arrays (Si-MEA) can scalably record and modulate neural activity at high spatiotemporal resolution, but their planar form factor poses challenges in targeting three-dimensional (3D) neural structures. This dissertation presents novel approaches to interface Si-MEA with neural tissues. A method is first presented that builds upon previous work in integrating massively parallel microwire bundles with Si-MEA. To miniaturize the device footprint, the flip-chip bonding technique was extended to establish reliable, large-scale, and individual electrical contacts between the microwire bundle and Si-MEA.Next, a direct-print method is introduced for fabricating microelectrodes on top of Si-MEA. Leveraging 2-photon polymerization and scalable microfabrication technologies, this method allowed scalable fabrication of microelectrode arrays with customizable positioning, shapes, and heights, facilitating precise targeting of neuron populations distributed in 3D. The effectiveness of this approach in interfacing with the retina was demonstrated through selectively targeting retinal ganglion cell (RGC) somas while mitigating interference from axon bundles. The method achieved high-fidelity, high-resolution, and large-scale RGC recording with significantly reduced axonal interference, demonstrating previously unattained capabilities. Such advancements hold the promise of interfacing Si-MEA to various parts of the nervous system, unlocking new avenues for neuroscience research and therapeutic interventions.
- 일반주제명
- Silicon
- 일반주제명
- Neurons
- 일반주제명
- Investigations
- 일반주제명
- Electrodes
- 일반주제명
- Semiconductors
- 일반주제명
- Prostheses
- 일반주제명
- Macular degeneration
- 일반주제명
- Retina
- 일반주제명
- Brain research
- 일반주제명
- Polymerization
- 일반주제명
- Plasma etching
- 일반주제명
- Light emitting diodes
- 일반주제명
- Design
- 일반주제명
- Neurosciences
- 일반주제명
- CMOS
- 일반주제명
- Nervous system
- 일반주제명
- Photoreceptors
- 일반주제명
- Electrical engineering
- 일반주제명
- Ophthalmology
- 일반주제명
- Optics
- 일반주제명
- Polymer chemistry
- 기타저자
- Stanford University.
- 기본자료저록
- Dissertations Abstracts International. 87-05A.
- 전자적 위치 및 접속
- 로그인 후 원문을 볼 수 있습니다.
MARC
008260126s2024 us c eng d■001000017360810
■00520260202105622
■006m o d
■007cr#unu||||||||
■020 ▼a9798265427373
■035 ▼a(MiAaPQ)AAI32316520
■035 ▼a(MiAaPQ)Stanfordmr447tc0537
■040 ▼aMiAaPQ▼cMiAaPQ
■0820 ▼a620
■1001 ▼aWang, Pingyu.
■24510▼aFrom Silicon to Neurons: Designing Three-Dimensional Microelectronic Interfaces for Targeted, High-Density, and Large-Scale Neural Signal Readout
■260 ▼a[Sl]▼bStanford University▼c2024
■260 1▼aAnn Arbor▼bProQuest Dissertations & Theses▼c2024
■300 ▼a114 p
■500 ▼aSource: Dissertations Abstracts International, Volume: 87-05, Section: A.
■500 ▼aAdvisor: Melosh, Nicholas.
■5021 ▼aThesis (Ph.D.)--Stanford University, 2024.
■520 ▼aSilicon-based microelectronic arrays (Si-MEA) can scalably record and modulate neural activity at high spatiotemporal resolution, but their planar form factor poses challenges in targeting three-dimensional (3D) neural structures. This dissertation presents novel approaches to interface Si-MEA with neural tissues. A method is first presented that builds upon previous work in integrating massively parallel microwire bundles with Si-MEA. To miniaturize the device footprint, the flip-chip bonding technique was extended to establish reliable, large-scale, and individual electrical contacts between the microwire bundle and Si-MEA.Next, a direct-print method is introduced for fabricating microelectrodes on top of Si-MEA. Leveraging 2-photon polymerization and scalable microfabrication technologies, this method allowed scalable fabrication of microelectrode arrays with customizable positioning, shapes, and heights, facilitating precise targeting of neuron populations distributed in 3D. The effectiveness of this approach in interfacing with the retina was demonstrated through selectively targeting retinal ganglion cell (RGC) somas while mitigating interference from axon bundles. The method achieved high-fidelity, high-resolution, and large-scale RGC recording with significantly reduced axonal interference, demonstrating previously unattained capabilities. Such advancements hold the promise of interfacing Si-MEA to various parts of the nervous system, unlocking new avenues for neuroscience research and therapeutic interventions.
■590 ▼aSchool code: 0212.
■650 4▼aSilicon
■650 4▼aNeurons
■650 4▼aInvestigations
■650 4▼aElectrodes
■650 4▼aSemiconductors
■650 4▼aProstheses
■650 4▼aMacular degeneration
■650 4▼aRetina
■650 4▼aBrain research
■650 4▼aPolymerization
■650 4▼aPlasma etching
■650 4▼aLight emitting diodes
■650 4▼aDesign
■650 4▼aNeurosciences
■650 4▼aCMOS
■650 4▼aNervous system
■650 4▼aPhotoreceptors
■650 4▼aElectrical engineering
■650 4▼aOphthalmology
■650 4▼aOptics
■650 4▼aPolymer chemistry
■690 ▼a0389
■690 ▼a0317
■690 ▼a0544
■690 ▼a0381
■690 ▼a0752
■690 ▼a0495
■71020▼aStanford University.
■7730 ▼tDissertations Abstracts International▼g87-05A.
■790 ▼a0212
■791 ▼aPh.D.
■792 ▼a2024
■793 ▼aEnglish
■85640▼uhttp://www.riss.kr/pdu/ddodLink.do?id=T17360810▼nKERIS▼z이 자료의 원문은 한국교육학술정보원에서 제공합니다.


